New Products

The new A4970 from Allegro MicroSystems Europe is a dual, full-bridge PWM motor driver IC featuring the latest DMOS technology to provide a significant reduction in quiescent and switching power losses.

Toshiba Electronics Europe (TEE) has announced two new ultra-miniature photocouplers* that provide ‘drop-in’ replacement for some of the company’s most popular coupler parts while reducing board mounting profiles by over 17%.

Aeroflex Incorporated, a wholly owned subsidiary of Aeroflex Holding Corp. (NYSE:ARX), announced today a major feature upgrade to its market-leading 3920 Radio Test Set.

FCI, a leading manufacturer of connectors and interconnect systems, announces the PwrBlade+™ AC/DC power distribution connector system. This next-generation power connector is focused on demanding power applications requiring higher linear current density and low power loss.

APEM Components, a leading manufacturer of quality switches, LED indicators, and joysticks, announces MEC Pushbutton Switches will become available through APEM effective January 16th, 2012. The two companies have been affiliated since APEM Components acquired MEC in 1998. MEC has been an industry leader of high quality Pushbutton Switches since 1938.

Synchronized with the market launch of the new XMC4000 microcontroller (MCU) family of Infineon Technologies which is based on ARM® Cortex™-M4 processor, PLS Programmierbare Logik & Systeme presents its Universal Debug Engine (UDE) 3.2.1, optimized test and debug tools for the high performance and also energy efficient SoC devices.

TTI, Inc., the global distributor of Passive, Interconnect, Relay & Switch and Discrete components, has announced two additions to Murata’s LQH series of wirewound power inductors that feature low profile, improved current saturation and low DC resistance.

The VEAM PowerLock Box™ from leading global connector manufacturer and supplier ITT Interconnect Solutions enables emergency power to be quickly and safely re-connected to large facilities such as supermarkets, defence installations, factories, hospitals and offices in the event of failure of the mains supply.

Maxim Integrated Products Inc. (NASDAQ: MXIM) today announced its TINI family of highly integrated SoCs and codecs for consumer applications. Offering unparalleled functional integration, TINI products enable system designers to free board space for new differentiating features in smartphones, tablet PCs, smart TVs, and home-monitoring cameras.

Ramtron International Corporation (Nasdaq: RMTR), the leading developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products, today announced the world’s lowest energy nonvolatile memory product.

Designed with a programmable function, NMB’s new LED driver offers high efficiency, 10W to 20W power rating, and a 0 to 10W voltage dimming function.

Following the announcement of its XTRM products family (-60°C to +230°C) of high-temperature and extreme reliability electronics components, X-REL is proud to announce the availability of five new products belonging to two product families:

The Han(R) HPR range of industrial connector housings from HARTING now includes a enlarged version which makes it possible to assemble the 4-pole version of the Han(R) HC Modular 250 high-current contact system to the Han(R) HPR size 16 B as well as the previous size 24B.

CHERRY has announced it has launched a dedicated gaming keyboard featuring CHERRY red MX switches in the UK. The new keyboard boasts full “N” key rollover which allows multiple keys to be pressed simultaneously, a feature required by the gaming community and impossible to do on a normal non-gaming keyboard.

Baolab Microsystems has announced that it will have evaluation kits of its recently announced 3D NanoCompass™ available at the end of February 2012. This electronic 3-axis CMOS MEMS NanoCompass technology uses Baolab's patented, award winning NanoEMS™ technology to create nanoscale MEMS (Micro Electro Mechanical Systems) within the standard metal structure of a high volume manufactured CMOS wafer

Hectronic, a specialist in embedded PC development and manufacturing, has announced H6059, a Qseven module based on the new AMD T40E and T40R ultra low power dual core and single core accelerated processing units (APU) and the A55E embedded chipset.

ADLINK Technology, Inc. (TAIEX: 6166), a leading supplier of industrial building blocks, introduces the PICMG 2.0 compliant cPCI-6210 Series, a 6U CompactPCI processor blade based on the latest quad- and dual-core 2nd Generation Intel® Core™ i7 and Intel® Core™ i5 processors and up to 16 GB DDR3-1600 memory support.

TTI, Inc., the global distributor of Passive, Interconnect, Relay & Switch and Discrete components, has announced two additions to Murata’s LQH series of wirewound power inductors that feature low profile, improved current saturation and low DC resistance.

The Telegärtner UMTC (Ultra Miniature Telecommunication Connector) range, available in the UK from Quadrant, is an ultra-miniature, 50ohm coaxial connector, compatible with U.FL, MHF (I-PEX) connector series and other connector types.

This week at International CES 2012, Toshiba will be demonstrating the latest additions to its lineup of flash memory offerings – the TransMemory-EX TM series of USB flash memory products. The new drives are compliant with the new USB 3.0 standards – known as Super Speed USB*1. Initial storage capacities include a 32GB model and a 64GB model.