Publication date: 30 June 2009
Based on Lattice’s 90 nanometer hybrid flexiFLASH™ technology, the XP2 family’s new Chip Scale packaging enables realization of design requirements in the tightest form-factor automotive applications such as automotive camera modules, telematics systems, parking assistance systems and multimedia systems.
The Chip Scale 132 BGA packaging has been fully qualified and characterized to meet AEC-Q100 requirements from the Automotive Electronics Council, and is available for the XP2-5 and XP2-8 devices, with five thousand and eight thousand LUTs (Look Up Tables) available, respectively. Measuring 64 mm2 and 1.35 mm in height, the package footprint is the smallest available for non-volatile FPGAs.
Avnet Memec, a business unit of Avnet Electronics Marketing EMEA, is a highly specialised semiconductor distributor, operating on a pan-European basis and employing a significant number of engineers to support customers’ design efforts. Avnet Memec specialises in highly innovative suppliers and technologies, which will help a variety of customers to differentiate their designs.
Its area of specialisation extends from Analog and Microcontrollers to RF, Datacom and Networking. The business unit operates out of 31 offices in 19 European countries and represents major semiconductor franchises on a pan-European basis. http://www.avnet-memec.eu
